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HG Semiconductor Announces Key Management Appointments

HONG KONG, Feb 7, 2023 - (ACN Newswire via SEAPRWire.com) - HG Semiconductor Limited ("HG Semiconductor", together with its subsidiaries, "the Group"; stock code: 6908. HK) today announced the appointments of Dr. XU Zhihong ("Dr. Xu") as Vice Chairman and Executive Director; Dr. CAO Yu ("Dr. Cao") as Chief Executive Officer and Executive Director; and Dr. CHEN Zhen ("Dr. Chen") as Executive Director, with effect from 6 February 2023. The appointments are expected to further strengthen the Group's third-generation semiconductor business. Dr. Xu, previously the managing director of CMB Wing Lung Bank Limited and general manager of the Financial Markets Department of Industrial and Commercial Bank of China, has extensive experience in corporate financial planning. He has received the honour of Special Government Allowances of the State Council as a National Expert, and also served as a committee member of the Financial Products Committee of the People's Bank of China and a council member of the China Urban Financial Society. Dr. Xu held senior management position of China Dive Company Limited (stock code: 300526.SZ) and DTXS Silk Road Investment Holdings Company Limited (stock code: 0620.HK). Dr. Cao has joined HG Semiconductor since 2021, and is the Vice President of Engineering of Xuzhou GSR Semiconductor Co., Ltd. ("Xuzhou GSR") and FastPower Inc. ("FastPower") which are respectively the indirect subsidiary and wholly-owned subsidiary of the Group. Dr. Cao is a core expert in the compound semiconductor business with over 20 years of proven semiconductor research, development and production experience in epitaxial growth, characterisation, device design and processing of electronic and optoelectronic devices based on GaN, InN, AlN, GaAs, InP, and related ternary and quaternary alloys. Dr. Cao has authored/co-authored 4 book/book chapters, 12 filed patents, and over 170 journal and conference papers. As a Senior Member of the Institute of Electrical and Electronics Engineers ("IEEE"), he has also served as a committee member for IEEE EDS Compound Semiconductor Devices & Circuits Committee (2019-present) and IEEE Senior Member Application Review Panel (2021-present), as well as Electrochemical Society ("ECS") Member at large, Electronics and Photonics Division: EPD executive committee member (2021-present). Dr. Cao was a technical committee member and session chair for Device Research Conference (2016-2018), International Workshop on Nitride Semiconductors (2018), Lester Eastman Conference (2018, 2020, 2021), IEEE Electron Devices Technology and Manufacturing (2021, 2022), ECS Meetings (2019-2021). He received IEEE George E. Smith Award in 2016 and is an invited reviewer for 15 prestigious research journals.Dr. Chen, joined the Group in 2021 and is a core expert in the GaN semiconductor business and the general manager of Xuzhou GSR. He is also a director of FastPower, with over 20 years of experience in research, development, production and management in the field of GaN-based optoelectronics devices. He has mastered the core technologies of GaN electronic devices and fullband solid-state light-emitting devices as well as proprietary technology of 8-inch silicon-based GaN epitaxial growth. He had been a Research Fellow with Singapore-MIT Alliance, a Postdoctoral Fellow with the University of South Carolina, and an Associate Project Scientist with University of California at Santa Barbara, where he had also worked with Nobel Prize winner Professor Shuji Nakamura and Professor Umesh Mishra, a member of the American Academy of Engineering, in relation to the performance of GaN high electron mobility transistor developed by the University of California, and researched GaN based ultraviolet to visible LED design, growth and characterization, applications in high-power, high frequency electronics. Dr. Chen also held a core management and technical position in Nanchang Lattice Power Corporation where he was involved in the production of silicon-based GaN whereby the company won the first prize of China's National Science and Technology Innovation Award in 2015.Dr. Chen has been the vice president of a well-known semiconductor company in the United States, where he is engaged in the research, development and production of GaN-based external devices. He has authored or coauthored 3 book chapters, over 50 peer reviewed papers and 20 conference proceedings. He has applied for more than 30 domestic and foreign patents and more than 10 patents have been granted. Dr. Chen is also a senior member of the IEEE Photonics Society, and a senior member of the IEEE Electronic Devices Association. His current research interests include III-nitride-based electronic devices and optical devices with wavelength from red to deep ultraviolet. Pursuant to the service agreements between the Group and Dr. Xu, Dr. Cao and Dr. Chen respectively, Dr. Xu, Dr. Cao and Dr. Chen have been appointed as Executive Directors of the Group for an initial term of three years commencing from 6 February 2023, renewable automatically for successive terms of one year each commencing from the next day after the expiry of the then term of employment, subject to retirement by rotation and re-election at annual general meetings in accordance with the articles of association of the Group and the Listing Rules.The management of HG Semiconductor welcome Dr. Xu, Dr. Cao and Dr. Chen for joining the Board. Leveraging the extensive experiences and expertise of the three leaders, the Group believes this will facilitate the development of its third-generation semiconductor GaN business and accelerate the achievement of its goal to become an integrated device manufacturing ("IDM") enterprise, further leading the Group to the path of success. Meanwhile, at the second group study session held by the Political Bureau of the Communist Party of China (CPC) Central Committee, President Xi Jinping stressed that it is imperative to accelerate self-reliance in science and technology so as to relieve the shackles imposed by some countries whom have tightened on China's development of core technologies. To echo with the national policy, the Hong Kong Innovation & Technology (I&T) Development Blueprint promulgated by the Hong Kong Government clearly pointed out that the government will strengthen the support for strategic industries, including new energy vehicles and semiconductor chips. Thus, the management of the Group believes that growing opportunities will be presented under the national and local governments' support. Following the appointment of the industry experts, it is expected that the Group will embark on a new phase of high-growth. The Group will continue its efforts to pursue its business expansion, with an ultimate goal of achieving long-term sustainable growth and brining the best returns to its shareholders.About HG Semiconductor LimitedHG Semiconductor Limited (6908.HK) is principally engaged in semiconductor product business in China, including the design, development, manufacturing, subcontracting services and sales of light-emitting diode ("LED") beads and a new generation of semiconductor gallium nitride ("GaN"). The Group is committed to accelerating its research and development and expansion in the application of GaN related products, with an aim to become a leading semiconductor company with the integration of design, manufacturing and sales of semiconductor chips, as well as providing total solutions with higher efficiency and competitive system cost.For more details, please visit www.hg-semiconductor.com Copyright 2023 ACN Newswire. All rights reserved. (via SEAPRWire)

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Issuance of Shares and Unlisted Warrants to GCL Technology Chairman Zhu Gongshan was Formally Approved at HG Semiconductor’s Extraordinary General Meeting

HONG KONG, Dec 13, 2022 - (ACN Newswire via SEAPRWire.com) - HG Semiconductor Limited ("HG Semiconductor", together with its subsidiaries, "the Group"; stock code: 6908. HK) announced that the resolution of the extraordinary general meeting was duly passed in relation to the investment agreement dated on 4 August 2022 (the "Investment Agreement"), which the Group entered into with Mr. Zhu Gongshan ("Mr. Zhu"), the Founder, Chairman and Executive Director of GCL Technology Holdings Limited (Stock code: 3800.HK; "GCL"), signifying that Mr. Zhu has officially become a major shareholder of the Group. Pursuant to the Investment Agreement, the Group has agreed to allot and issue, and Mr. Zhu has agreed to subscribe for 60 million subscription shares ("Shares Subscription") and 60 million warrants ("Warrants Subscription"). In view that the due diligence examinations have been completed, and that Mr. Zhu is reasonably satisfied with the results of the examinations, he will participate in the Shares Subscription and Warrants Subscription through his designated beneficially owned entity Profit Act Limited. The subscription shares and warrant shares shall be subject to a lock-up period of 18 months commencing on the date of issuance during which cannot be sold or transferred.The subscription is a testament to Mr. Zhu's confidence in the prospects of HG Semiconductor. In addition to becoming a major strategic shareholder of the Group, HG Semiconductor entered into a strategic cooperation framework agreement earlier on 7 September 2022 with Golden Concord Group Limited ("Golden Concord Group"), a company ultimately held under a discretionary trust with Mr. Zhu and his family members as beneficiaries, to commence a long-term strategic cooperation focusing on the application of third generation gallium nitride ("GaN") power chips in the field of new energy. Leveraging its leading position in the new energy industry with comprehensive strategic layout, Golden Concord Group will assist HG Semiconductor to tap into the market of new energy supply chain, helping the Group develop its upstream and downstream businesses as well as becoming its close business partner.The global chip business has been developing rapidly and the changing technology specifications and demand of different markets are the key factors for the Group to source suitable raw materials from different suppliers to cater for the Group's production needs of GaN chips. With the rich resources and leading technology accumulated by Mr. Zhu and Golden Concord Group in the field of new energy over the years, it is believed that the silicon wafers supplied to the Group are of high quality given the crystal lattice of the entire solid of the silicon wafers is continuous, unbroken to its edges, and free of any grain boundaries. The supply of silicon wafers from Golden Concord Group will boost the Group's confidence and ensure the stability and quality of its GaN business development. On the other hand, the third-generation semiconductors such as GaN and other broadband semiconductors are expected to be excellent materials for the energy conversion chain, as they can effectively reduce energy losses and improve energy conversion rates. The Group would supply the manufactured GaN chips to Golden Concord Group from its newly developed Xuzhou Factory with advanced technology, which are the fundamental components used in Golden Concord Group's business in energy engineering, solar inverter and energy storage technology. Golden Concord Group, with its high-quality silicon wafers, may become one of the suppliers to the Group, while it will also become a potential customer of the Group's GaN chips, meaning that both parties would complement each other.As the digital economy accelerates, the semiconductor industry has gradually become a significant impetus for the global economy and socioeconomic development. The report of the 20th National Congress of the Communist Party of China (CPC) also clearly pointed out that it is necessary to uphold the country's self-reliance and self-improvement in science and technology, opening up new areas and new arenas in development and accelerate China's scientific and technological strength, and steadily fostering new growth drivers and new strengths. At the same time, in order to actively respond to the national policy guidelines, the Hong Kong government has recently established the Microelectronics Technology Consortium and is studying chip technology, promoting more high value-added and high technology manufacturing processes and production lines in Hong Kong; the third-generation semiconductors will therefore play a vital role in the development of technology and economic diversification.To actively expand its third-generation semiconductor GaN business, HG Semiconductor has established a new factory earlier, with an area of over 7,000 square metres in Xuzhou ("Xuzhou Factory"), and has recently started manufacturing its own 6-inch GaN power device epitaxial wafers, representing a breakthrough and the first stage of the Group's GaN chip business. The Group expects that full production of GaN chips will commence by early 2024. In addition, the Group's research and development team will promote the GaN chips by implementing the GaN chips in the circuitry designed for different applications, to raise the customers' loyalty, while at the same time, relevant GaN devices will also be launched to increase sales.The management of HG Semiconductor is honored to introduce Mr. Zhu Gongshan as a major strategic shareholder of the Group. After nearly two years of business transformation, the Group has established its outstanding strengths in GaN power semiconductors and new energy industry. The Share Subscription and the Warrant Subscription represent a good opportunity for the Group to raise additional capital for its GaN business development, thereby accelerating its business development. Meanwhile, leveraging Mr. Zhu's background as a major strategic shareholder of the Group, HG Semiconductor is expected to further accelerate the research and development ("R&D") of GaN technology and application in the new energy field, and stride towards the goal of becoming an integrated device manufacturing ("IDM") enterprise with semiconductor design and manufacturing as the core, as well as the integration of R&D, manufacturing, testing, and sales. HG Semiconductor will continue to pursue its established business strategies to capture market opportunities, enhance stakeholder value and achieve long-term sustainable growth, with the aim of providing the best returns to shareholders.About HG Semiconductor LimitedHG Semiconductor Limited (6908.HK) is principally engaged in semiconductor product business in China, including the design, development, manufacturing, subcontracting services and sales of light-emitting diode ("LED") beads and a new generation of semiconductor gallium nitride ("GaN"). The Group is committed to accelerating its research and development and expansion in the application of GaN related products, with an aim to become a leading semiconductor company with the integration of design, manufacturing and sales of semiconductor chips, as well as providing total solutions with higher efficiency and competitive system cost.For more details, please visit www.hg-semiconductor.com Copyright 2022 ACN Newswire. 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Hitachi High-Tech Launches High-Throughput and High-Sensitivity Wafer Surface Inspection System LS9600

TOKYO, Dec 13, 2022 - (JCN Newswire via SEAPRWire.com) - Hitachi High-Tech Corporation announced today the launch of the LS9600, a new system for detecting particles and defects on non-patterned wafer surfaces. It features a new high-output, short-wavelength laser that improves throughput at the sensitivity levels required for the mass production of cutting-edge semiconductor devices by approx. 2.6 times compared to our previous generation systems. By introducing this product, Hitachi High-Tech will continue to help to improve yields and reduce inspection costs associated with customers' mass production of semiconductor devices.Wafer Surface Inspection System LS9600Development BackgroundNon-patterned wafer inspection systems are used for applications such as controlling the condition (cleanliness) of non-patterned wafers to manage particles and defects in semiconductor device manufacturing equipment. Due to the shrinking of semiconductor devices, the defects of interest (DOIs), which impact yield during the manufacturing process, have also become smaller in size. As a result, there is a growing need for high-sensitivity inspection that can detect DOIs of 20 nm and smaller across the entire surface of non-patterned wafers. In addition to high-sensitivity inspection to improve yield, there is also a strong demand for high throughput, which leads to lower inspection costs.Key New TechnologiesThis system achieves both high sensitivity and high throughput by implementing the following new technologies.1. High-Output, Short-Wavelength LaserThe deep-ultraviolet laser has a higher output and shorter wavelength than legacy systems, which increases the amount of light scattered by microscopic defects, thereby achieving a higher degree of sensitivity.2. New Optical Detection SystemThe new optical detection system features a larger surface area to capture light scattered by DOIs compared to the legacy systems. In addition, its newly developed high-sensitivity sensor has improved the detection rate of weak scattered light by around 20%.3. New Data Processing SystemImproved scattered light data-processing algorithms deliver higher sensitivity, together with higher throughput due to high-speed, real-time data processing.By using this product, as well as our wafer optical inspection systems, and electron beam-based products such as a traditional CD-SEM(1) and DR-SEM(2), Hitachi High-Tech is working to meet customers' various needs in processing, measurement, and inspection throughout the semiconductor manufacturing process. We will continue to provide innovative and digitally enhanced solutions to our products for the upcoming technology challenges, and create new value together with our customers, as well as contributing to cutting-edge manufacturing.(1) CD-SEM (Critical Dimension-Scanning Electron Microscope): An equipment for measuring the microscopic circuit patterns on semiconductor wafers. Used for inspections on semiconductor devices development and production lines, these systems are essential for yield management.(2) DR-SEM (Defect Review-Scanning Electron Microscope): An equipment for reviewing the microscopic circuit patterns and defects on semiconductor wafers. Used for inspections on semiconductor devices development and production lines, these systems are essential for yield management.About Hitachi High-TechHitachi High-Tech, headquartered in Tokyo, Japan, is engaged in activities in a broad range of fields, including manufacture and sales of clinical analyzers, biotechnology products, and analytical instruments, semiconductor manufacturing equipment and analysis equipment. and providing high value-added solutions in fields of social & industrial infrastructures and mobility, etc. The company's consolidated revenues for FY 2021 were approx. JPY 576.8 billion [USD 5.1 billion]. For further information, visit www.hitachi-hightech.com/global/Contact:Yuuki MinataniBusiness Planning Dept., Metrology Systems Div.,Nano-Technology Solution Business Group, Hitachi High-Tech CorporationE-mail: yuki.minatani.dc@hitachi-hightech.com Copyright 2022 JCN Newswire. All rights reserved. (via SEAPRWire)

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Singapore-based Semiconductor Equipment and Materials Specialist Rokko Marks 30 Years of R&D Breakthroughs, Focus on Quality & Reliable Technical Support

SINGAPORE, Dec 13, 2022 - (ACN Newswire via SEAPRWire.com) - Rokko Holdings Ltd ("Rokko") has marked its 30th anniversary as a proven specialist in the global semiconductor industry, having overcome successive challenges and business cycles through its commitment to innovation and R&D, with a focus on quality and strong technical support at the core of its corporate culture.Rokko's Founder and Managing Director Mr Gary LimWith over 89 patents granted related to its semiconductor equipment and advanced material divisions, Rokko has remained nimble while forging industry leadership in providing advanced materials support as well as high-precision equipment for the back end (assembly, testing and packaging services) of the industry.Headquartered in Singapore, it has benefited from the country's predictable industrial policy and robust legal framework that protects Intellectual Property. Fortuitously, the Singapore domicile has also allowed Rokko to navigate recent challenges of the U.S.-China 'tech war' that have impacted the semiconductor industry in particular.Rokko has a substantial customer base in China and Taiwan which accounts for over half of its annual revenue for the past few years. The balance is derived from the ASEAN region which has generally avoided geopolitical tensions affecting the chip sector.Rokko's Founder and Managing Director Mr Gary Lim said, "As 2022 draws to an end, we mark a major milestone in our history as a Singapore enterprise. Our management team has remained resolute in innovating constantly to stay ahead of the curve. This spirit has helped us to overcome many downturns in industry cycles, and in riding out the recent challenges of the pandemic."According to market research by Gartner, the global semiconductor industry is estimated to achieve global revenue of USD612 billion in 2022. With many industry experts expecting the revenue to rise to USD1.0 trillion by 2030, the sector - and Rokko's prospects - remain bright.Rokko was established in 1992 by Mr Lim, with an initial 12 employees. It has grown to a team of 250 that includes a pool of talented engineers, operating from 2 facilities in Singapore (including the corporate headquarters) and another 2 manufacturing facilities in Johor state, Malaysia.The company is renowned for its proprietary back-end semiconductor high-precision equipment such as dual-track Auto Sawing and Sorting systems and Auto Vision Inspection (AVI) systems - which are sought after for their high productivity, reliability and quality.These and other breakthrough equipment and tooling designs developed by Rokko's exceptional R&D team have set new industry standards. Customers using Rokko's products and solutions have been able to halve their capital expenditure for the complex singulation process of back-end semiconductor packaging and assembly in recent years.In its second area of semiconductor expertise - advanced materials for semiconductor packaging - Rokko has successfully developed a complex IC leadframe design with an extremely fine line etching process to meet customers' advanced packaging standards.Rokko's major customers now include the world's top-ranking Outsourced Semiconductor Assembly and Testing (OSAT) players as well as MNCs involved in advanced packaging materials. This successful record has helped Rokko to achieve a critical competitive advantage in volume production after substantial investments in R&D and capacity expansion in recent years.With a strong commitment to sustainability, the company's environmentally conscious investments include a certified 'Class A' wastewater management system at its facility in Malaysia.Rokko's products are also certified for the automobile industry's quality standard - IATF16949 - and are also accredited with the ISO14000 environmental compliance standard.About Rokko Holdings Ltd. Established in 1992, Rokko Holdings Ltd. ("Rokko") and its subsidiaries (the "Group") provide precision engineering services to well-established customers in the semiconductor and electronics industries. The Group has operations in 4 locations in Singapore and Malaysia, with a combined staff strength of 250. Rokko has been granted 89 patents to date. Its strong emphasis on R&D, backed by a team of talented engineers, has allowed the Company to thrive despite intense competition, and economic and industry cycles. Rokko is renowned for breakthrough technology and deep commitment to quality and customer support dedicated to the back-end Semiconductor Assembly and Testing sector. Its products include complex IC leadframe design as well as high-precision tooling and equipment under ROKKO trademarks.Rokko Holdings Ltd. Tel: +65 6749 5885; Fax: +65 6747 5979Email: sales@rokko.netWebsite: www.rokko.net Copyright 2022 ACN Newswire. All rights reserved. (via SEAPRWire)

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HG Semiconductor Officially Commences Production of GaN Power Electronics Epitaxial Wafer

HONG KONG, Nov 2, 2022 - (ACN Newswire via SEAPRWire.com) - HG Semiconductor Limited ("HG Semiconductor", together with its subsidiaries, "the Group"; stock code: 6908.HK) is pleased to announce that the Group has recently started manufacturing its own 6-inch gallium nitride ("GaN") power electronics epitaxial wafer (the "Wafer"). The successful manufacturing of the Wafer happens far earlier than the expected timetable and paves the way to the Group's quick industrialisation and mass production of GaN third-generation conductors, which represents a major achievement of the Group's business transformation into a supplier of third-generation semiconductor GaN, marking a milestone in the commercialisation of its third-generation semiconductor GaN business.Leveraging its professional expertise, strong scientific team and research and development ("R&D") capabilities in third-generation semiconductor GaN manufacturing, HG Semiconductor has been on its path of strategic transformation in recent years. The Group's technical team has capitalised on their extensive experience to debug production facilities and technology in just three months, and successfully produced the Wafers that reach the high-yield standards of international manufacturers, and subsequently beginning sales of the Wafer. The Group expects to commence pilot production of chips in the second quarter of 2023, and commence mass production by early 2024. In addition, HG Semiconductor has also launched GaN-related fast charging products such as fast charging chargers since the second half of this year. The Group is of full confidence in the prospects of manufacturing and sales of GaN-related products. In recent years, the development of the global semiconductor industry has undergone significant changes. With increasing uncertainty in the external environment, independence and self-control in developing the whole industrial chain is expected become the key development of the domestic semiconductor industry in the future. The report of the 20th National Congress of the Communist Party of China (CPC) also clearly pointed out that scientific and technological progress and professional talents are crucial to the future development of the country. The report implies that the Chinese government will invest a huge amount of financial resources in the technology industry, which in other words, that mainland China will increase its research expenditures on semiconductor technology and speed up the realisation of high-tech self-reliance. Alongside with the strong support from the Chinese national policies, the Hong Kong government will also allocate more resources in the R&D and manufacturing of third-generation semiconductors in the future. The Hong Kong Applied Science and Technology Research Institute (ASTRI) has proposed to invest additional resources to promote the development of national semiconductor industry, underlining the importance of the industry to regional economic development.Third-generation semiconductor epitaxial wafers, being one of the core components in the semiconductor industry chain, are semi-finished product which are to be produced as chips through subsequent processing. The successful manufacturing of the Wafer represents a giant leap to HG Semiconductor in reaching its ultimate goal of mass chip production. The third-generation semiconductor epitaxial wafers are widely adopted in the fields of photovoltaics, energy storage, wind power, automotive electronics, 5G, Internet of Things (IoT) and other end-user applications. The rapid growth and robust market demand has led to further speed up the production of domestic epitaxial wafer production facilities, resulting in an optimistic expectation of a continued massive boom in the entire semiconductor epitaxial wafer industry. The market size of the GaN semiconductor epitaxial wafer reached US$420 million in 2021, and is projected to reach US$1.5 billion by 2028, with a compound annual growth rate (CAGR) of 21.2% from 2022 to 2028. With the favourable government policies, extensive downstream applications and domestic substitution acceleration, the Group will continue to spearhead its R&D and expand its design and manufacturing of third-generation semiconductor business and system applications, with a view to achieving breakthroughs in the domestic substitution technology in the future, thereby becoming a leading integrated device manufacturing ("IDM") enterprise covering full-chain operation including R&D, manufacturing, packaging, testing, and sales of semiconductors. The management of the Group is confident in the development of its third-generation semiconductor business and believes that GaN has tremendous advantages in emerging applications such as new energy automotive industry. Currently, the Group's epitaxial wafer products have now officially entered full-scale production, together with the strong execution capability and rich experience in mass production of the Group's technical team, it is believed that the semiconductor chip business will gradually bear fruits. At earlier time, the Group formally entered into a shares subscription and warrants subscription agreement with Mr. Zhu Gongshan, the Founder, Chairman and Executive Director of GCL Technology Holdings Limited (Stock code: 3800.HK), and subsequently entered into a strategic cooperation framework agreement with GCL Group Limited, a discretionary trust of Mr. Zhu Gongshan and his family members as beneficiaries, under which both parties will cooperate closely in the application of GaN chips in the new energy sector and accelerate the deployment in the GaN industry chain. The management of the Group believes that the tremendous opportunities and market demand in the semiconductor industry will bring more opportunities to the Group. It is expected that the Group will embrace a high-growth period, striving to provide the best returns to its shareholders in the long run.About HG Semiconductor LimitedHG Semiconductor Limited (6908.HK) is principally engaged in semiconductor product business in China, including the design, development, manufacturing, subcontracting services and sales of light-emitting diode ("LED") beads and a new generation of semiconductor gallium nitride ("GaN"). The Group is committed to accelerating its research and development and expansion in the application of GaN related products, with an aim to become a leading semiconductor company with the integration of design, manufacturing and sales of semiconductor chips, as well as providing total solutions with higher efficiency and competitive system cost.For more details, please visit www.hg-semiconductor.com Copyright 2022 ACN Newswire. All rights reserved. (via SEAPRWire)

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Mr. Chow Bok Hin Felix was appointed as the new director of ASTRI

HONG KONG, Oct 24, 2022 - (ACN Newswire via SEAPRWire.com) - Niche-Tech Semiconductor Materials Limited ("Niche-Tech Semiconductor" or the "Company", with its subsidiaries collectively referred as the "Group"; HKEx Stock Code: 8490.HK), a leading semiconductor packaging materials manufacturer, is pleased to announce that Mr. Chow Bok Hin Felix, Executive Chairman and Executive Director of the Company, was appointed as the new director of The Hong Kong Applied Science and Technology Research Institute ("ASTRI") for the period from 21 October 2022 to 20 October 2024.ASTRI is an institute founded by the Government of the Hong Kong Special Administrative Region in 2000 with the mission of enhancing Hong Kong's competitiveness through applied research. ASTRI's core R&D competence in various areas is grouped under four Technology Divisions: Trust and AI Technologies; Communications Technologies; IoT Sensing and AI Technologies and Integrated Circuits and Systems. It is applied across six core areas which are Smart City, Financial Technologies, Re-Industrialisation and Intelligent Manufacturing, Digital Health, Application Specific Integrated Circuits and Metaverse. As of 2021/22, ASTRI has transferred almost 1,250 technologies to the industry and has been granted over 1,000 patents in the Mainland, the US, and other countries.Mr. Chow has over 13 years of experience in the electronic materials industry. As the Co-founder, Executive Chairman and Executive Director of the Company, he is primarily responsible for the overall management, strategic planning, operation and development of the Group. Being the new director of ASTRI, Mr. Chow's role and position in Niche-Tech Semiconductor will not be changed. What's more, he will contribute his extensive industry experience, with ASTRI's joint efforts, to optimize the ecosystem of innovation and technology in Hong Kong, thereby, contributing to the electronic materials industry by transferring most advanced technologies to the field. Furthermore, under the platform of ASTRI, Mr. Chow will make full use of the industry and R&D resources to introduce cutting-edge technologies to the Company so as to promote its long-term development.Mr. Chow Bok Hin said, "I am very honoured to join the family of ASTRI. It has been a challenging moment for global economies since 2019, as the Sino-U.S. trade tensions continued and brought uncertainties as well as negative impact to the global industries. However, in the long run, the demand for high efficiency power electronic products is still expected to grow outstandingly, which will drive the further growth of semiconductor industry and bring new opportunities to the semiconductor packaging materials industry. As the new director of ASTRI, I will contribute to the electronic materials industry. Being the Executive Chairman and Executive Director of the Company, I believe that it would be a great opportunity to promote development of Niche-tech and grasp the opportunities arising from the latest trend in the industry."About Niche-Tech Semiconductor Materials Limited Niche-Tech Semiconductor Materials Limited ("Niche-Tech Semiconductor") was established in 2006 in Hong Kong and was successfully listed on the GEM of Hong Kong Stock Exchange in 2019. Niche-Tech is a manufacturer of semiconductor packaging materials and new materials in the High and New Technology field, specializing in the development, manufacture and sales of bonding wire, encapsulant and special metal materials. Since 2010, the Group has become a High and New Technology Enterprise in the PRC. Establishing Guangdong Province Semiconductor and Microelectronics Materials Engineering Technology R&D Center, , Niche-Tech was recognised as a National Intellectual Property Outstanding Enterprise by the State Intellectual Property Office of the PRC in 2016 and then obtained the qualifications recognition such as Guangdong Academic Experts (Corporate) Workstation and Guangdong Science and Technology Expert Workstation.For media enquiries, please contact Bright Communication International Limited:Ms. Ashley KungMobile: (852) 52406263Email: ir@brightcommns.com Copyright 2022 ACN Newswire. All rights reserved. (via SEAPRWire)

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Key Industry Players to Discuss IoT, Automotive, Wireless, and Supply Chain Trends and Opportunities at EAC 2022

TAIPEI, TAIWAN, Oct 17, 2022 - (ACN Newswire via SEAPRWire.com) - Recent economic and geopolitical developments, on top of the supply chain shortages and tight inventories in some markets, have driven market watchers to reduce their forecast growth for the semiconductor industry this year. Gartner Inc., for one, reduced its earlier forecast of 13.6% global semiconductor revenue growth this year to just 7.4%.The market research firm, however, noted that this down cycle is not new and has happened many times before. Despite the softness in the consumer market, demand remains resilient in the data center sector due to the continued investment in cloud infrastructure, while the automotive electronics sector is expected to see double-digit growth amid the increasing IC content per vehicle due to the transition to electric and autonomous cars.Overall, the outlook remains bright for the semiconductor industry. According to industry association SEMI, global semiconductor equipment billings rose by 7% quarter-on-quarter in the second quarter this year, and by 6% year-over-year to $26.43 billion. Taiwan, China, and South Korea led the rest of the world in terms of quarterly billings.Semiconductor companies worldwide are expected to expand their 300mm fab capacity at nearly 10% compound average growth rate from 2022 to 2025, SEMI said in its 300mm Fab Outlook to 2025 report. Mainly driving this growth is strong demand for automotive semiconductors and new government funding and incentive programs in multiple regions.Highlighting such trends and innovations, the inaugural Electronics Asia Conference (EAC) 2022, scheduled for October 18–20, 2022, will feature some of the leading semiconductor companies discussing new applications and markets driving the technology developments in the semiconductor industry.Organized by AspenCore, the publisher of EETimes Asia, EETimes India, and EDN Asia, the three-day event will feature a virtual conference and exhibition, and will focus on the latest trends and opportunities on the Internet of Things (IoT), automotive electronics, wireless technologies, and the supply chain.The full roster of companies presenting at the virtual conference include:ArmArrow Electronics (NYSE: ARW)Bluetooth SIG Inc.Cadence Design Systems Inc. (NASDAQ: CDNS)Chip 1 ExchangeDiodes Inc. (NASDAQ: DIOD)Efinix Inc.Fair Friend Group (FFG)Infineon Technologies Asia Pacific Pte LtdMolexMosChip Technologies (BOM: 532407)Mouser ElectronicsNordic Semiconductor (NOD.OL)NXP Semiconductors (NASDAQ: NXPI)Renesas Electronics Corp.Rohde & SchwarzSilicon Laboratories Inc. (NASDAQ: SLAB)SMITHSTMicroelectronics (EPA: STM) (NYSE: STM)Texas Instruments Inc. (NASDAQ: TXN)For more information and to register, visit https://ve.eetasia.com/EAC2022.About AspenCoreAspenCore is a unique collection of brands and products that have set the standard in meeting the demands of today's engineers.We reach over 15 million technologists, designers, engineers, and managers. We connect this electronics community to reliable news, authoritative analysis, industry trends, and daily information on new technology.Our brands include EE Times, Electronic Products, EPSNews, ESM China, IoT Times, Power Electronics News, EDN, EEWeb, Electro Schematics, Elektroda.pl, Embedded.com, Planet Analog, and more.For more information, visit https://aspencore.com.Contact Person:Celia ShihMarketing ManagerTaiwan/ASEAN Marketing and Circulation DepartmentT: +886 227591366 Ext. 103/222E: celia.shih@aspencore.com Copyright 2022 ACN Newswire. All rights reserved. (via SEAPRWire)

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Electronics Asia Conference 2022 Puts Spotlight on IoT, Automotive Electronics, Wireless Technologies, and the Semiconductor Supply Chain

The global semiconductor revenue is expected to reach $661 billion in 2022, up by 13.7% year-over-year, according to International Data Corp. (IDC). While industry demand was driven by the industrial and automotive industries in 2021, IDC expects 5G, consumer electronics, wireless technologies, datacenters, and wearables will continue drive demand this year.The Asia Pacific region, which dominated the global semiconductors market in 2021, is projected to exhibit the highest growth rate from 2022 to 2028, mainly driven by the surge in the adoption of high-end devices and growing demand for consumer electronics, according to market analyst BlueWeave Consulting.In particular, the Internet of Things (IoT) market in Asia-Pacific region (APEJ) will continue to grow this year, accelerating by 9.1% from 6.9% in 2021, according to IDC. Despite supply chain issues and geopolitical tensions, rising demand for remote operations, better network coverage, and the deployment of commercial 5G and testbeds are driving IoT adoption in the region, which in turn is expected to boost IoT spending to $436 billion in 2026, IDC notes.And it is the ecosystem of semiconductor device makers, equipment manufacturers, and raw materials suppliers, with the support of the academe and government institutions, that are enabling these technology developments.To put the spotlight on the key players and the latest technologies and trends in the electronics and semiconductor industry, AspenCore, the publisher of EETimes Asia, EETimes India, and EDN Asia, will hold the inaugural Electronics Asia Conference (EAC) 2022 on October 18–20, 2022.The three-day event will feature a virtual conference and exhibition, highlighting the latest technology trends, innovations and developments, and strategies to help the electronics and semiconductor industry stakeholders navigate the challenges, take advantage of, and build new opportunities in the current global manufacturing landscape.With the theme "Gearing Up for Growth: Electronics and Semiconductor Technologies Driving Industry Developments in Asia," EAC 2022 will put the spotlight on industries and applications including IoT, wireless technologies, automotive electronics, and the supply chain.Confirmed companies presenting at the virtual conference include Arm, Arrow Electronics Inc. (NYSE: ARW), Cadence Design Systems Inc. (NASDAQ: CDNS), Chip 1 Exchange, Infineon Technologies AG (FSE: IFX); Nordic Semiconductor (NOD.OL), NXP Semiconductors (NASDAQ: NXPI), MosChip Technologies (BOM: 532407), Mouser Electronics, Silicon Laboratories Inc. (NASDAQ: SLAB), SMITH, STMicroelectronics (EPA: STM) (NYSE: STM), and Texas Instruments Inc. (NASDAQ: TXN).For more information and to register, visit Electronics Asia Conference (EAC) 2022.About AspenCoreAspenCore is a unique collection of brands and products that have set the standard in meeting the demands of today's engineers.We reach over 15 million technologists, designers, engineers, and managers. We connect this electronics community to reliable news, authoritative analysis, industry trends, and daily information on new technology.Our brands include EE Times, Electronic Products, EPSNews, ESM China, IoT Times, Power Electronics News, EDN, EEWeb, Electro Schematics, Elektroda.pl, Embedded.com, Planet Analog, and more.For more information, visit https://aspencore.com.Contact Person:Celia ShihMarketing ManagerTaiwan/ASEAN Marketing and Circulation DepartmentT: +886 227591366 Ext. 103/222E: celia.shih@aspencore.com Copyright 2022 ACN Newswire. All rights reserved. (via SEAPRWire)

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HG Semiconductor Announces 2022 Interim Results

HONG KONG, Aug 30, 2022 - (ACN Newswire via SEAPRWire.com) - HG Semiconductor Limited ("HG Semiconductor", together with its subsidiaries, "the Group"; stock code: 6908.HK) is pleased to announce its unaudited consolidated results for the six months ended 30 June 2022 (the "first half of 2022" or the "Period"). Business ReviewDuring the Period, while developing its existing LED beads, the Group continued to expand its business presence in the third-generation semiconductor industry chain. In the first half of 2022, the economic situation in China was challenging due to the pandemic. Supply chains and manufacturing industry were hard hit by various pandemic precautions and control measures, including mandatory lockdowns. The Group's business was inevitably affected. Revenue decreased by approximately 42.4% to approximately RMB43.4 million during the Period (first half of 2021: approximately RMB75.3 million). The Group recorded a loss of approximately RMB51.5 million for the Period (first half of 2021: loss of approximately RMB41.2 million), mainly attributable to the decrease in revenue under the poor market environment with suppressed demand and delayed procurement plans from the Group's customers in China. Loss per share for the Period was approximately RMB9.14 cents (first half of 2021: loss per share of approximately RMB9.70 cents).The management of the Group revealed that since its gradual strategic transformation, the Group remained committed to accelerating its research and development ("R&D") efforts to rapidly expand into the third-generation semiconductor design and production markets, and to providing integrated solutions that offer higher efficiency and keener competitiveness in terms of system costs. The Group is determined to evolve as an integrated device manufacturing ("IDM") enterprise covering full-chain operation including R&D, manufacturing, packaging, testing and sales. Because of the extensive use of GaN in the fast-charging segment, the technology has steadily rolled out to electric vehicles, wireless charging, 5G infrastructure and other areas, pointing to great market potential in the future. The Group will continue to strengthen its business presence along the GaN industry chain, promote the rapid development of various businesses, and speed up GaN production capacity and swiftly move to a period of yielding returns on investment.Active Development of the New-Energy Vehicle and Fast-charging Pile Segment; Accelerated Development of the GaN BusinessDuring the Period, the Group strategically invested in multiple leading third-generation semiconductor enterprises in China and overseas, and actively entered into strategic and framework cooperation agreements, with the aim of leveraging its existing platform and resource advantages and to speed up R&D and the technological applications of GaN. Following the acquisition of GSR GO Holding Corporation (which is primarily engaged in R&D of fast-charging solutions for battery system) and its subsidiaries ("GSR GO Group") the previous year, the Group also focused on high-voltage new energy vehicles by investing in VisIC Technologies Ltd ("VisIC"), an Israel-based developer of GaN-related products, and also focused on consumer products by investing in GaN Systems Inc. ("GaN Systems"), a Canadian GaN technology leader. In the first half of 2022, the Group continued to seek cooperation with domestic and overseas enterprises in the GaN segment, and to develop GaN products alongside related sales and marketing.In March 2022, the Group entered into a strategic cooperation agreement with Cogobuy Group (stock code: 400.HK), a leading enterprise service platform in the integrated circuit industry. The aim of this cooperation includes helping the Group to sell its own chips in China, and to engage the two parties into a long-term strategic cooperation arrangement involving chip application and development. In addition, the Group entered into a strategic cooperation agreement with China Titans Energy Technology Group Co., Limited (stock code: 2188.HK) in May 2022. The two parties will jointly engage in R&D of next-generation fast-charging stations using third-generation semiconductor technology developed by the Group in the next three years, develop fast-charging pile services in Hong Kong, and jointly launch a fast-charging system solution. The Group also entered into a non-legally binding memorandum of understanding with GUH Holdings Berhad (stock code: 3247.KL). Through this cooperation, the Group will expand its sales of fast-charging batteries and GaN components to Malaysia and Southeast Asia with a view to increasing its sources of income.Actively Promoting GaN Site Testing and Positively Contributing to "Carbon Peak" and "Carbon Neutrality"The Group is committed to implementing a strategic transformation by actively developing its third-generation semiconductor business and has established a semiconductor production factory covering more than 7,000 square metres in the Xuzhou Economic and Technological Development Zone in Jiangsu Province, China. At the same time, the Group also owns an R&D centre in Shenzhen that enhances the design and production of materials and components. Alongside its entry into the third-generation semiconductor business last year, the Group is continuing to strengthen its R&D capabilities. During the Period, the Group has applied for the registration of five invention patents, one utility model and one appearance patent. All of the above patent applications have been accepted.Xuzhou GSR Semiconductor Company Ltd., a wholly-owned subsidiary of the Group, entered an important milestone during the Period by conducting the first publicised industry field trial of GaN with GaN systems in the power infrastructure of an internet data centre ("IDC"). The test results showed that the total energy consumption of IDCs could be reduced by 10%. Compared to traditional silicon-based power supplies, this is expected to yield power savings of up to 20%. This energy-saving result potentially increases the profit margins of IDCs, reduces operating costs and lowers energy consumption, supporting a sustainable future as the Group hopes to reduce the carbon footprints of IDCs. As part of the overall drive to achieve a green environment, the use of GaN power transistors for more energy-efficient power supply units and power modules offers a solid technical foundation for the high-quality, green development of IDCs, which also aligns with China's goal of "carbon neutrality".Focusing on R&D; World-class R&D Standards and the Management TeamWhile strengthening its R&D capabilities, the Group has continued to recruit cutting-edge talent and management expertise from the semiconductor industry to provide valuable guidance to its third-generation semiconductor business, and for strategic investment and development. During the Period, the Group's Global Strategic Advisory Committee was formally established. Members of the committee have extensive experience of the GaN semiconductor industry, as well as of strategic investment and development, to provide effective strategies and tactical advice to the Group. Furthermore, the Group engaged a number of experts in the semiconductor sector to manage its Xuzhou Factory and scientific research projects, giving strong technical support to its semiconductor product operations. Core experts include Dr. Chen Zhen, who is in the GaN semiconductor business, and Dr. Thomas Hu, in device design and technical manufacturing of GaN high-electron mobility transistors (HEMT), alongside Mr. Lu Ruilin and Mr. Min Junhui, who each have extensive experience in the semiconductor industry and of wafer fabrication technology and management. These experts bring years of experience in the fields of third-generation semiconductor production and management, mergers and acquisitions, investment, fund management and business administration, and are poised to lead the Group into a bright future.OutlookThe year 2022 has represented a crucial phase of industrial upgrading and the implementation of China's "dual- carbon" policy, with the semiconductor industry thus becoming a focus of attention. The Third-Generation Semiconductor Industry Development Report, issued by the China Advanced Semiconductor Industry Innovation Alliance, predicts that the market for third-generation semiconductor electronic devices in China will be worth nearly RMB20 billion in 2024, with a compound annual growth rate (CAGR) exceeding 40% in the next five years. Consulting firm Grand View Research predicts that the global GaN semiconductor device market will reach US$5.85 billion in 2027, with a CAGR of 20% from 2020 to 2027, as third-generation semiconductors boasting high efficiency and low power consumption become hot items. GaN, as a third-generation semiconductor material, has higher bandgap, and is the material with theoretically the highest enhancement of electro-optical and photoelectric conversion efficiency in theory.At present, third-generation semiconductor devices are moving rapidly into applications in new-energy vehicles, photovoltaic inverters, 5G base stations, power delivery and fast-charging, among other GaN devices are mainly used in 5G base stations. Thanks to the support of the "14th Five-Year Plan", led by the central government, the Group will further develop and explore third-generation semiconductor products, with a particular focus on GaN, and is committed to becoming an IDM enterprise specialising in third-generation semiconductors. Looking ahead, as the Group continues to expand its market presence in GaN, quality and efficiency improvements at related businesses along the industry chain will take place. The future of GaN business should be more than just promising. The Group will continue to promote the construction and commissioning of production lines at its Xuzhou Factory, which is currently undergoing renovation, and for which machinery is being purchased, with production expected to commence by early 2024. The Group will also strengthen its existing business and its R&D capabilities, and in the future, it will continue to cooperate with leading enterprises and attract more semiconductor industry talent to further accelerate R&D and expand the applications of GAN-related products.The management of the Group believes that the increasing popularity of electric vehicles in Mainland China and Hong Kong will provide a promising future for the development and commercialisation of the next generation charging piles in both jurisdictions. The Group will explore every opportunity to establish a strong foothold in the fast-charging battery solution business in both Mainland China and Hong Kong, aims to inject new life into its business development, and bring long-term returns to its shareholders, while at the same time pressing ahead with R&D and the manufacture of GaN-related products, aiming to be the industry leader in supplying third-generation GaN semiconductors to the Greater China market.About HG Semiconductor LimitedHG Semiconductor Limited (6908.HK) is principally engaged in semiconductor product business in China, including the design, development, manufacturing, subcontracting services and sales of light-emitting diode ("LED") beads, new generation of semiconductor gallium nitride ("GaN") chips, GaN components and related application products, as well as fast charging products. Leveraging its industry expertise in LED manufacturing, the Group is dedicated to accelerating its research and development and expansion in the application of GaN related products, with an aim to become a leading semiconductor company with the integration of design, manufacturing and sales of semiconductor chips, as well as providing total solutions with higher efficiency and competitive system cost. For more details, please visit www.hg-semiconductor.com Copyright 2022 ACN Newswire. All rights reserved. (via SEAPRWire)

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HG Semiconductor Announced Lock-up Undertakings by Shareholders

HONG KONG, Jun 7, 2022 - (ACN Newswire via SEAPRWire.com) - HG Semiconductor Limited ("HG Semiconductor", together with its subsidiaries, "the Group"; stock code: 6908.HK) is pleased to announce that two of the shareholders of the Group, including major shareholder GSR Capital Special Opportunity Fund L.P. ("GSR Capital") and strategic shareholder Great Ocean Prime Holding Limited ("Great Ocean"), have voluntarily decided not to sell the Group's shares held before May 2024. Moreover, in respect of the 24,000,000 Shares currently held by Great Ocean, Great Ocean has voluntarily decided to use 8,000,000 Shares each year in 2022 and 2023 to award and motivate core management members of the Group. The initiative is the evidence of the shareholders' confidence in the long-term value and business development of the Group.GSR, one of the major shareholders of the Group, is an exempted limited partnership which holds 56,000,000 shares of the Group; while the total capital injection of GSR is 50% each held by GoldenSand Capital Ltd (a company which is wholly owned by Mr. Sonny Wu and being the general partner of GSR) and Mr. Sonny Wu (being the limited partner of GSR, as well as the chairman of the Global Strategic Advisory Committee and a core management member of the Group) respectively. In view of the strong potential of third-generation semiconductor gallium nitride (GaN) and its vast number of applications, HG Semiconductor, with its extensive experience in LED manufacturing, has been striving to seize the opportunities and accelerate business expansion to design, development, manufacturing, subcontracting and sales of GaN related products in recent years. The Group has actively entered into strategic cooperation with several third-generation semiconductor companies and invested in a number of leading firms to accelerate breakthroughs in core technologies, in addition to successfully invite a number of senior semiconductor experts to join the team, in order to strengthen and promote the development of its GaN business. The Group has entered into cooperation with China Titans Energy earlier for promoting fast charging pile technology and product sales in China and Hong Kong to develop the fast-charging field in the new energy ecosystem. The management of the Group is grateful to have the strong support from GSR Capital and Great Ocean. Their decision is a clear signal of the great trust and a strong vote of confidence in the Group's solid business strategies and development. With the tremendous opportunities and market demand in the semiconductor industry, as well as the support of national policies, the Group is determined to develop itself as a pioneer integrated device manufacturer (IDM) in semiconductor that spans the whole industry chain, including R&D, manufacturing, packaging and packaging testing, and sales. HG Semiconductor will continue to actively pursue set business strategies to capture market opportunities, with an aim of enhancing stakeholder value, achieving long term sustainable growth and delivering satisfactory returns to its shareholders. About HG Semiconductor LimitedHG Semiconductor Limited (6908.HK) is principally engaged in semiconductor product business in China, including the design, development, manufacturing, subcontracting services and sales of light-emitting diode ("LED") beads, new generation of semiconductor gallium nitride ("GaN") chips, GaN components and related application products, as well as fast charging products. Leveraging its industry expertise in LED manufacturing, the Group is dedicated to accelerating its research and development and expansion in the application of GaN related products, with an aim to become a leading semiconductor company with the integration of design, manufacturing and sales of semiconductor chips, as well as providing total solutions with higher efficiency and competitive system cost. For more details, please visit www.hg-semiconductor.com Copyright 2022 ACN Newswire. All rights reserved. (via SEAPRWire)

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Hitachi Power Semiconductor Device Develops High-Voltage Motor Driver IC Products

TOKYO, Jun 7, 2022 - (JCN Newswire via SEAPRWire.com) - Hitachi Power Semiconductor Device, Ltd. (HPSD) has developed two High-Voltage Motor Driver ICs primarily for room air-conditioners. The single-chip IC products 'ECN30216' & 'ECN30624' are able to tolerate large variation of supply voltage. Both products possess the function of shutting down all the output devices when overvoltage is detected in the motor drive state and thereby achieves the withstanding voltage of 1,000V. "ECN30216" is mainly for the fan-motors used for in-room units of air-conditioners, and "ECN30624" is principally for those of exterior units. The products are to be shipped out as of Jun. 2022. Through providing these products, HPSD will globally support the energy- efficiency/energy-saving of home appliances including room air-conditioners in order to contribute to realizing Carbon-Free Society.Motor Driver IC 'ECN30216(Left)' & 'ECN30624(Right)'A High-Voltage Motor Driver IC is one of those components mounted on an inverter control board which keeps proper operation of motors installed in home appliances such as room air- conditioners or air-cleaners, and is indispensable power semiconductor device for highly efficient, energy-saving home appliances. On the other hand, in some areas where rapid increase of demand for inverter air-conditioners is expected, it is required to develop the power semiconductor devices which bear sizable fluctuation of power supply voltage.This time, HPSD has developed the High-Voltage Motor Driver IC having the withstanding voltage of 1000V which is realized by implementing the function to disable all the output devices which supply the driving power to the motor upon detecting excessive power supply voltage in the motor drive state. In addition, unique design of new upper arm(1) drive circuit has made it possible to include the capacitor inside the driver IC, eliminating two external capacitors required for conventional such products, and thereby saving space to improve customer's freedom of designing motor or inverter control board for home appliances.HPSD has supplied its power electronics products for Mobility application such as Traction, and EV so far, but is accelerating its development activities of the products having high environmental values for the realization of Carbon-Free Society. The company will continue to contribute to actualizing Carbon-Free Society through developing and providing the power semiconductor devices that help cut down the power consumption, and CO2 emission.(1) High side power semiconductor device of an inverter circuit.About Hitachi Power Semiconductor Device, Ltd.HPSD with its long history/achievement of power semiconductor product development combined with its innovative device technology keeps contributing to the growing business of social innovation. It has three main product categories that are "IGBT/SiC", "High Voltage IC" and "Diodes". It is our commitment to develop high environmental value products utilizing our high-voltage, and low-loss technology. For more details, please visit our website at www.hitachi-power-semiconductor-device.co.jp/en/index.html.About Hitachi, Ltd.Hitachi drives Social Innovation Business, creating a sustainable society with data and technology. We will solve customers' and society's challenges with Lumada solutions leveraging IT, OT (Operational Technology) and products, under the business structure of Digital Systems & Services, Green Energy & Mobility, Connective Industries and Automotive Systems. Driven by green, digital, and innovation, we aim for growth through collaboration with our customers. The company's consolidated revenues for fiscal year 2021 (ended March 31, 2022) totaled 10,264.6 billion yen ($84,136 million USD), with 853 consolidated subsidiaries and approximately 370,000 employees worldwide. For more information on Hitachi, please visit the company's website at www.hitachi.com.Business Contact：Hitachi Power Semiconductor Device, Ltd.Inquiry Form: www8.hitachi.co.jp/inquiry/hpsd/en/general/form.jsp Copyright 2022 JCN Newswire. All rights reserved. (via SEAPRWire)

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Hitachi High-Tech Launches Dark Field Wafer Defect Inspection System DI2800, Achieving High-Sensitivity 100% Inspection for Semiconductor Devices in the IoT and Automotive Fields

TOKYO, Jun 3, 2022 - (JCN Newswire via SEAPRWire.com) - Hitachi High-Tech Corporation announced the launch of the Hitachi Dark Field Wafer Defect Inspection System DI2800, a critical component in any semiconductor manufacturer's metrology capabilities. The DI2800 is a high-speed metrology system designed to identify defects and particles on patterned wafers up to 8 inches (200 mm) in diameter. With its high throughput and performance, the DI2800 can help ensure device reliability and safety, particularly for highly sensitive applications such as Internet of Things (IoT) and automotive fields where 100% inspection is required.Hitachi Dark Field Wafer Defect Inspection System DI2800Development BackgroundWith the rise of next generation communication networks (5G) and accelerated adoption of electric vehicles in recent years there has been an increase in demand for semiconductor devices in the IoT and automotive fields where reliability and safety are paramount. In conventional semiconductor device manufacturing, spot-check inspections are performed for the purposes of process management and yield improvement. However, for semiconductor devices used in the IoT and automotive fields, 100% inspection must be carried out to help identify defective products during manufacturing to ensure high reliability and safety. To serve these fields a wafer defect inspection system must have the ability to perform 100% inspection with high sensitivity at high speed.Key FeaturesHitachi High-Tech has developed Dark Field Wafer Defect Inspection System DI2800 to respond to these market needs. This product uses scattering-intensity simulation technology to optimize the illumination and detection optics, enabling highly sensitive inspection of patterned-wafer defects developed during the manufacturing process. It has a detection sensitivity of 0.1-micron standard particle size on mirrored wafers. This performance is even possible on devices as small as 0.3-mm square, which has previously proved challenging due to sensitivity and data processing limitations. With a highly optimized inspection sequence, the DI2800 is capable of throughputs of over 40 200-mm wafers per hour.Future InitiativesHitachi High-Tech will provide this product to customers in combination with the Advanced CD Measurement SEM CS4800 and 3D SEM CT1000, which are already on the market, meeting the diverse metrology needs mass production of semiconductor devices for the IoT and automotive fields. Going forward, Hitachi is committed to product improvement by leveraging data collected from all three product lines to offer new data-based, value-added solutions, contributing to the improved reliability and safety of semiconductor devices in these fields.Hitachi High-Tech is working to meet customers' needs in metrology and inspection for the R&D and mass production of semiconductor devices by supplying electron beam-based products such as traditional CD-SEM and wafer inspection systems based on optical technologies. Hitachi High-Tech will continue to provide innovative solutions for the upcoming technology challenges. Hitachi High-Tech will contribute to the development of cutting-edge technologies by creating new social and environmental value in collaboration with its customers.About Hitachi High-TechHitachi High-Tech, headquartered in Tokyo, Japan, is engaged in activities in a broad range of fields, including manufacture and sales of clinical analyzers, biotechnology products, and analytical instruments, semiconductor manufacturing equipment and analysis equipment. and providing high value-added solutions in fields of social & industrial infrastructures and mobility, etc. The company's consolidated revenues for FY 2021 were approx. JPY 576.8 billion [USD 5.1 billion]. For further information, visit http://www.hitachi-hightech.com/global/ Copyright 2022 JCN Newswire. All rights reserved. (via SEAPRWire)

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HG Semiconductor Introduces New Strategic Investor

HONG KONG, May 19, 2022 - (ACN Newswire via SEAPRWire.com) - HG Semiconductor Limited ("HG Semiconductor", together with its subsidiaries, "the Group"; stock code: 6908.HK) is pleased to announce the introduction of a new strategic investor, Wide Yield Investment Holding Limited ("Wide Yield Investment"), which supports the vision and expansion of the Group to building a world-class third-generation semiconductor industry chain platform.Star Eagle Enterprises Limited disposed of 100,500,000 Shares (representing approximately 17.83% of the total issued shares of the Group) to Wide Yield Investment at the total consideration of HK$302,103,000. Upon completion, Wide Yield Investment and its ultimate beneficial owner has become a substantial shareholder of the Group. The management of the Group is delighted to introduce Wide Yield Investment into HG Semiconductor as one of its major shareholders. The investment is a testament to the confidence of Wide Yield Investment in the Group's business strategies and prospects. Through strategic investor introduction, HG Semiconductor believes that its shareholding structure and financial position will be further strengthened, giving it a full play to develop and deepen its presence in gallium nitride (GaN) semiconductor sector. The Group will continue to build on its existing strengths, accelerating growth in its GaN semiconductor business, striving to generate continuous and stable returns for its shareholders in the long run. About HG Semiconductor LimitedHG Semiconductor Limited (6908.HK) is principally engaged in semiconductor product business in China, including the design, development, manufacturing, subcontracting services and sales of light-emitting diode ("LED") beads, new generation of semiconductor gallium nitride ("GaN") chips, GaN components and related application products, as well as fast charging products. Leveraging its industry expertise in LED manufacturing, the Group is dedicated to accelerating its research and development and expansion in the application of GaN related products, with an aim to become a leading semiconductor company with the integration of design, manufacturing and sales of semiconductor chips, as well as providing total solutions with higher efficiency and competitive system cost. For more details, please visit www.hg-semiconductor.com Copyright 2022 ACN Newswire. All rights reserved. (via SEAPRWire)

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DENSO and USJC Collaborate on Automotive Power Semiconductors

Kariya, Kuwana, Japan/Hsinchu, Taiwan, Apr 26, 2022 - (JCN Newswire via SEAPRWire.com) - DENSO Corporation, a leading mobility supplier, and United Semiconductor Japan Co., Ltd. ("USJC"), a subsidiary of global semiconductor foundry United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)("UMC"), today announced that the companies have agreed to collaborate on the production of power semiconductors at USJC's 300mm fab in order to serve the growing demand in the automotive market. An insulated gate bipolar transistor (IGBT) line will be installed at USJC's wafer fab, which will be the first in Japan to produce IGBTs on 300mm wafers. DENSO will contribute its system-oriented IGBT device and process technologies while USJC will provide its 300mm wafer manufacturing capabilities to bring 300mm IGBT process into mass production, scheduled to start in the first half of 2023. This collaboration is supported by the renovation and decarbonization program for indispensable semiconductors of Japan's Ministry of Economy, Trade and Industry. As the development and adoption of electric cars accelerate amid a global effort to reduce carbon emissions, the demand for semiconductors required in the electrification of vehicles is also rapidly increasing. IGBTs are core devices in power cards, serving as efficient power switches in inverters to convert DC and AC currents in order to drive and control electric vehicle motors. "DENSO is very glad to be the member of first companies in Japan to start mass production of IGBTs on 300 mm wafers," said Koji Arima, President of DENSO. "Semiconductors are becoming increasingly important in the automotive industry as mobility technologies evolve, including automated driving and electrification. Through this collaboration, we contribute to the stable supply of power semiconductors and electrification of automobiles.""As a key foundry player in Japan, USJC is committed to supporting the government's strategy to boost domestic semiconductor production and the transition to more environmentally friendly electric vehicles," said Michiari Kawano, President of USJC. "We are confident that our foundry services certified by automotive customers combined with DENSO's expertise will produce high quality products to power the automotive trends of tomorrow.""We are pleased to have this win-win collaboration with a leading company such as DENSO. This is an important project for UMC and will expand our relevance and influence in the automotive segment," said Jason Wang, Co-President of UMC. "With our robust portfolio of advanced specialty technologies and IATF 16949 certified fabs in diversified locations, UMC is well placed to serve demand across auto applications, including advanced driver assistance systems, infotainment, connectivity, and powertrain. We look forward to capitalizing on more cooperation opportunities going forward with top players in the automotive space."About DENSODENSO is a $44.6 billion global mobility supplier that develops advanced technology and components for nearly every vehicle make and model on the road today. With manufacturing at its core, DENSO invests in its 200 facilities to produce thermal, powertrain, mobility, electrification, & electronic systems, to create jobs that directly change how the world moves. The company's 168,000+ employees are paving the way to a mobility future that improves lives, eliminates traffic accidents, and preserves the environment. Globally headquartered in Kariya, Japan, DENSO spent 10.0 percent of its global consolidated sales on research and development in the fiscal year ending March 31, 2021. For more information about global DENSO, visit https://www.denso.com/globalAbout UMCUMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC's comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI and BCD etc. Most of UMC's 12-in & 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has total 12 fabs in production with combined capacity over 800,000 wafers per month (8-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with worldwide total 20,000 employees. For more information, please visit: https://www.umc.com. Copyright 2022 JCN Newswire. All rights reserved. (via SEAPRWire)

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HG Semiconductor Announces 2021 Annual Results

Building up its Core Capabilities in GaN to Lay an All-round Strategic Layout for Business TransformationStriving to Become a Leading Supplier of Third-generation GaN Semiconductors in Greater China HONG KONG, Mar 31, 2022 – (ACN Newswire) – HG Semiconductor Limited (“HG Semiconductor”, together with its subsidiaries, “the Group”; stock code: 6908.HK) is pleased to announce its audited consolidated results for the year ended 31 December 2021 (the “Year”). While operating its light-emitting diode (LED) bead business, the Group is working hard to explore diversification opportunities. Recognising the strong potential of third-generation semiconductor gallium nitride (GaN) and its vast number of applications, the Group officially entered the third-generation semiconductor industry during the Year. Leveraging its industry expertise in LED manufacturing, the Group expanded its business to third-generation semiconductor and system application design and manufacturing activities. In line with its business development strategies, the Group has changed its company name to “HG Semiconductor Limited” since October 2021. HG Semiconductor is committed to strategically allocating resources for the development of its GaN business during the Year, hence LED business remained the main contributor of the Group’s annual results. During the Year, the total revenue of the Group increased by approximately 3.4% to approximately RMB126.1 million (2020: approximately RMB122.0 million). Due to the loss arising on acquisition of intangible assets and the recognition of equity-settled share-based payment expenses for the share options granted on 17 June 2021, loss for the Year was approximately RMB446.8 million (2020: net profit of approximately RMB 4.6 million). Excluding the impact of the abovementioned one-off loss and expenses, the Group’s loss for the Year was approximately RMB18.4 million. Basic and diluted loss per share was RMB0.92 (2020: basic and diluted earnings per share was RMB1.14 cents). The management of the Group revealed that COVID-19 pandemic continued to affect all around the globe during the Year, coupled with the disruption of global supply chains and escalating inflation, hindering the full recovery of the economy. However, during the pandemic, the recovery of the global semiconductor market has become more optimistic. With the strong market demand for chips, the Group expanded its business to third-generation semiconductor and system application solutions during the Year. Leveraging its expertise, the professionalism of its teams, and its research and development (R&D) capabilities in semiconductor manufacturing, the Group successfully transformed its business strategy and strategically deployed capital to invest in the world’s leading GaN companies. Business ReviewDuring the Year, the revenue of LED beads was approximately RMB126.1 million (2020: approximately RMB121.1 million), accounting for approximately 100.0% (2020: approximately 99.3%) of the total revenue. The increase in revenue during the Year was mainly attributable to the increase in sales volume driven by the strong demand for semiconductor products in China in the first half of 2021. In addition, the Group expedited the business transformation of the third-generation semiconductor business in various repects to build its core capabilities of GaN during the Year, including creating breakthroughs in core technologies, strengthening industry R&D and production management, etc., and achieving phenomenal progress. Strategic investments in leading technology companies to drive rapid business growthDuring the Year, the Group actively entered into strategic and framework cooperation agreements with a number of third-generation semiconductor companies and made strategic investments in a number of leading firms to accelerate breakthroughs in core technologies as it strived to technologically outperform its competitors. In May 2021, the Group completed the acquisition of GSR GO Holding Corporation, mainly engaging in R&D involving fast-charging solutions for battery systems, helping the Group to capturing the market potential of electric bicycle battery systems and related fast-charging solutions. The Group also invested in VisIC Technologies Limited and GaN Systems Inc., the world’s leading GaN companies, in August and November 2021 respectively. Strong technological advantages and solid progress towards complete production layoutThe Group has been actively enhancing GaN core equipment, R&D, and production facilities to optimise production management to cater for customers’ needs and produce more chips to meet that demand. The Group has set up a new factory in the Xuzhou Economic and Technological Development Zone that includes 7,000 square metres of ultra-clean chambers and 850 square metres of office space, and acquired machinery to expand its semiconductor production capacity. Meanwhile, the Group has set up a R&D centre in Shenzhen with its own design and R&D team to enhance the design and production of materials and devices, and accordingly strengthen its R&D capabilities industry-wide. During the Year, the Group obtained six fast-charging battery system patents for charging stations, charging conversion systems, charging modules and fast-charging equipment for electric vehicle charging stations. Strategic cooperation with target customers to generate early-stage profitsThe Group has successfully entered into strategic cooperation arrangements with target customers, laying solid foundations for business expansion in the long run. The Group entered into the three-year strategic cooperation agreement with Shenzhen Romoss Technology Co., Ltd. and Beijing Hongzhi Electric Technology Co., Ltd. to jointly provide solutions for semiconductors, GaN-related products and chipsets for fast-charging batteries. Building a world-class science and management teamTo accelerate R&D involving the Group’s third-generation semiconductors, the Group successfully invited a number of senior semiconductor experts to join the management and technology team during the Year. Moreover, the Group has established a Global Strategic Advisory Committee to strengthen and promote the development of its GaN business. The committee comprises three initial members: Mr. Sonny Wu, its chairman, and Mr. Kenneth James Bradley and Mr. Tang Yin Man, members of the Global Strategic Advisory Committee. The committee is responsible for reporting to and advising the management of HG Semiconductor on issues that the Group may face from time to time. OutlookThird-generation semiconductors are regarded as presenting an opportunity to secure rapid growth for the semiconductor industry in China. The country has also introduced a number of policies to support the R&D of key core technologies for high-end chips to develop independent control of the semiconductor industry. In the future, the Group will spare no effort to become a pioneer integrated device manufacturer (IDM) in semiconductor that spans the whole industry chain, including R&D, manufacturing, packaging and package testing, and sales. In addition to actively seeking cooperation with other enterprises, the Group will strengthen its own capabilities. The Group will continue to enhance its core equipment and various R&D and production support facilities, and is committed to renovating its Xuzhou factory, while continuing the construction and commissioning of production lines at the factory and enhancing its production capacity to satisfy future market demand. The Group will leverage the advantages brought about by its internal integration of resources, as it always does to enhance the efficiency of its operational management and shorten the time required to progress from product design to mass production, further consolidating its presence in existing markets and its R&D capabilities. The Group will continue to seek more collaboration opportunities with suitable third parties, and recruit more semiconductor talents to accelerate its R&D and create more applications for GaN-related products. The Group will also build a stronger sales team by recruiting sales professionals with extensive experience in the industry, which will help it to obtain cutting-edge advantages when approaching new customers. The management of the Group believe that, leveraging the Group’s strong technological advantages and the favourable national policies, the Group is poised to strategically transform its business in order to seize the opportunities arising from the huge market demand. The Group will allocate more resources and continue to build the broadest and deepest technological platform, while continuously improve its industry and product chains and further enhance its brand reputation. The management is confident in the Group’s future business performance, and believe that its GaN business will gradually support the Group’s revenue growth and become its growth engine in the future, thereby creating long-term returns for shareholders. About HG Semiconductor LimitedHG Semiconductor Limited (6908.HK) is principally engaged in semiconductor product business in China, including the design, development, manufacturing, subcontracting services and sales of light-emitting diode (“LED”) beads, new generation of semiconductor gallium nitride (“GaN”) chips, GaN components and related application products, as well as fast charging products. Leveraging its industry expertise in LED manufacturing, the Group is dedicated to accelerating its research and development and expansion in the application of GaN related products, with an aim to become a leading semiconductor company with the integration of design, manufacturing and sales of semiconductor chips, as well as providing total solutions with higher efficiency and competitive system cost. For more details, please visit www.hg-semiconductor.com

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Showa Denko Launches Mass Production of 6-inch SiC Single Crystal Wafers

TOKYO, Mar 28, 2022 - (JCN Newswire via SEAPRWire.com) - Showa Denko K.K. (SDK) (TOKYO: 4004) has launched mass production of silicon carbide single crystal wafers (SiC wafers) with a diameter of 6 inches (150 mm), which are used as materials for SiC epitaxial wafers*1 to be processed and installed into SiC-based power semiconductors (SiC power semiconductors).SiC power semiconductor has excellent heat-resisting property and high withstanding voltage much better than those of conventional silicon-based power semiconductor, which is currently the mainstream of power semiconductors. SiC power semiconductor contributes to improvement in power module's energy efficiency and downsizing. Therefore, the demand for SiC power semiconductors is increasing rapidly in various fields, especially those for use in xEVs, railcars, and industrial equipment.As an independent supplier of SiC epitaxial wafers, SDK has the global-top share in the market, and has been providing power-device manufacturers with Best in Class SiC epitaxial wafers. Therefore, SDK's SiC epitaxial wafers are highly acclaimed by power-device manufacturers in and outside Japan.SDK has been considering in-house production of SiC wafers, which are used as main material for SiC epitaxial wafers, aiming to improve quality of our SiC epitaxial wafers and establish a stable supply system for them. From 2010 to 2015, SDK took part in "Novel Semiconductor Power Electronics Project Realizing Low Carbon Emission Society *2," which was hosted and entrusted by the Ministry of Economy, Trade and Industry and New Energy and Industrial Technology Development Organization (NEDO), as a member of the "Research and Development Partnership for Future Power Electronics Technology*3." Furthermore, in 2018, SDK took over SiC-wafer related assets of Nippon Steel & Sumitomo Metal Group (current Nippon Steel Group)*4, and has been developing technologies for mass production of SiC wafers since then.This time, SDK decided to launch in-house mass production of 6-inch SiC wafers because plural customers have adopted SDK's SiC epitaxial wafers made from our in-house produced 6-inch SiC wafers. On the other hand, SDK will continue purchasing SiC wafers from our partners in order to respond to rapidly growing demand for SiC epitaxial wafers for power semiconductors. Thus, SDK will diversify sources of SiC wafers, thereby establishing stable supply chain for SiC epitaxial wafers.The Showa Denko Group aims to be a "Co-Creative Chemical Company" and contribute to the sustainable development of global society. Under this vision, SDK positions its operation to produce SiC epitaxial wafers, which contributes to efficient use of energy, as a next-generation business, and will allocate much of our business resources. The Group will continue contributing to the spread of SiC power semiconductors by maintaining "Best in Class" as its motto and continuing provision of high-performance and highly-reliable products.*1. "SiC epitaxial wafer" is a material for semiconductor, made from SiC wafer by depositing thin layer of epitaxial SiC on the surface of the wafer.*2. "Novel Semiconductor Power Electronics Project Realizing Low Carbon Emission Society" is a project aiming to establish technology for realization of stable supply of SiC wafers with large diameters. In 2010, this project was stared and entrusted by the Ministry of Economy, Trade and Industry, and, in 2011, the control of this project was transferred to New Energy and Industrial Technology Development Organization (NEDO).*3. "Research and Development Partnership for Future Power Electronics Technology" is an association established as a joint organization of academy, industry, and government aiming to improve technical level concerning next-generation power electronics.*4. For details of this, please refer to SDK's news release, "Showa Denko Acquires Assets Concerning SiC for Power Devices from Nippon Steel & Sumitomo Metal Group," which was announced on August 7, 2017. About Showa Denko K.K.Showa Denko K.K. (SDK; TSE:4004, ADR:SHWDY) is a major manufacturer of chemical products serving from heavy industry to computers and electronics. The Petrochemicals Sector provides cracker products such as ethylene and propylene, the Chemicals Sector provides industrial, high-performance and high-purity gases and chemicals for semicon and other industries, the Inorganics Sector provides ceramic products, such as alumina, abrasives, refractory/graphite electrodes and fine carbon products. The Aluminum Sector provides aluminum materials and high-value-added fabricated aluminum, the Electronics Sector provides HD media, compound semiconductors such as ultra high bright LEDs, and rare earth magnetic alloys, and the Advanced Battery Materials Department (ABM) provides lithium-ion battery components. For more information, please visit www.sdk.co.jp/english/.For further information, contact: Showa Denko K.K., Public Relations Group, Brand Communication Department, Tel: 81-3-5470-3235 Copyright 2022 JCN Newswire. All rights reserved. (via SEAPRWire)

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Rochester Electronics Partners with Kyoto Semiconductor Co., Ltd.

Kyoto Semiconductor expands customer access worldwide and offers long-term customer support by providing Rochester Electronics with high quality optical semiconductors for communication and sensing. NEWBURYPORT, MA, March 9, 2022 – (SEAPRWire) – Rochester Electronics LLC (Massachusetts, USA) is partnering with Kyoto Semiconductor Co., Ltd. (Kyoto, Japan), a leading optical device solution manufacturer with world-class technologies and Japanese quality, to collaborate in offering active and end-of-life (EOL) products to customers. “We are honored to announce a new partnership with Kyoto Semiconductor, a respected brand within the optical semiconductor landscape. It is through this strategic agreement, that our valued customers can rest assured to have a continued supply of Kyoto Semiconductor optical device solutions, which will not only be certified and guaranteed by Rochester but will also be 100% authorized by the original manufacturer – Kyoto Semiconductor.” – Colin Strother, Executive Vice President at Rochester Electronics LLC “Kyoto Semiconductor is pleased to collaborate with Rochester Electronics, known for the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. With this partnership, we extend our customer reach worldwide, with both EOL and active semiconductors. Our products are critical for the optical communication infrastructure and optical sensing equipment used for a long period of time. As we have a large variety of products similar to the EOL’ed products, and we can develop custom products, the partnership with Rochester Electronics will provide helpful solutions for the customers who need to perform long-term maintenance on the infrastructure or equipment. – Tsuneo Takahashi, CEO at Kyoto Semiconductor Co., Ltd. Upon this partnership, Kyoto Semiconductor products are available at Rochester Electronics. About Kyoto Semiconductor Kyoto Semiconductor was established in 1980 in Kyoto as a dedicated manufacturer of optical semiconductors. The semiconductors manufactured offer superlative performance and precision, suited for use in optical transmission. They are manufactured end-to-end, including pre-and postprocessing, and together with Kyoto Semiconductor’s unique packaging technology, at our location in Japan and made available to customers around the world. Kyoto Semiconductor leads the industry with world-standard technologies for optical device solutions based on Japanese quality and attention to production detail. For more information, visit: https://www.kyosemi.co.jp/en/ About Rochester Electronics Rochester Electronics is the world’s largest continuous source of semiconductors–100% Authorized by over 70 leading semiconductor manufacturers. As an original manufacturer stocking distributor, Rochester has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market. Rochester is the Semiconductor Lifecycle Solution. No other company compares to the breadth of Rochester’s product selection, value-added services, and manufacturing solutions. With direct sales and support staff in all major markets, complemented by a network of regional and global authorized channel partners, we aim to meet your needs over the phone or via our e-commerce platforms anytime, anywhere. For more information visit: www.rocelec.com Media Contact Rochester Electronics LLC Global Marketing Team Email: tcorbitt@rocelec.com  Kyoto Semiconductor Co., Ltd. Naoko Kodama Media Relations, Kyoto Semiconductor Co., Ltd. Email: Media_relation@kyosemi.co.jp SOURCE: Rochester Electronics LLC The article is provided by a third-party content provider. SEAPRWIRE makes no warranties or representations in connection therewith. Any questions, please contact cs@SEAPRWIRE.com Sectors: Top Story, Daily News SEAPRWIRE (www.seaprwire.com) offers newswire service in Southeast Asia (Indonesia, Thailand, Vietnam, Singapore, Malaysia, Philippines & Hong Kong )

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DENSO to Take Minority Stake in JASM

KARIYA, JAPAN, Feb 15, 2022 - (JCN Newswire via SEAPRWire.com) - TSMC (TWSE: 2330, NYSE: TSM), Sony Semiconductor Solutions Corporation ("SSS") and DENSO Corporation ("DENSO") today announced that DENSO will take a minority stake in Japan Advanced Semiconductor Manufacturing, Inc. ("JASM"), TSMC's majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan with a US$0.35 billion investment. With this equity investment, DENSO will hold a more than 10% equity stake in JASM. Construction of JASM's fab in Japan is scheduled to begin in the 2022 calendar year with production targeted to begin by the end of 2024. To support market demand, TSMC will also enhance JASM's capabilities with 12/16 nanometer FinFET process technology in addition to the previously announced 22/28 nanometer process and increase monthly production capacity to 55,000 12-inch wafers. With the additional capacity, the total capital expenditure for JASM's Kumamoto fab is estimated to be approximately US$8.6 billion with strong support from the Japanese government. The fab is expected to directly create about 1,700 high-tech professional jobs.The closing of the transaction between JASM and DENSO is subject to customary closing conditions."TSMC is very glad to welcome DENSO's participation in JASM to enable fresh innovations in the future of transportation together," said Dr. CC Wei, Chief Executive Officer of TSMC. "JASM is not only an opportunity for TSMC to support growing market demand for specialty technologies, it enables us to leverage Japan's top-notch semiconductor talent and contribute to the growth of the global semiconductor ecosystem.""While the global demand for semiconductors is expected to grow, we expect JASM to contribute to securing a stable supply of logic wafers, not only for us but also the overall industry," said Terushi Shimizu, President and CEO of Sony Semiconductor Solutions Corporation. "We are very pleased to have DENSO as a new member, and we look forward to working with them to support the launch of JASM.""Semiconductors are becoming increasingly important in the automotive industry as mobility technologies evolve, including automated driving and electrification," said Koji Arima, President and CEO of DENSO Corporation. "Through this partnership, we contribute to the stable supply of semiconductors over the medium to long term and thus to the automotive industry."About TSMCTSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world's leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry's leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.TSMC deployed 291 distinct process technologies, and manufactured 12,302 products for 535 customers in 2021 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.About Sony Semiconductor SolutionsSony Semiconductor Solutions Corporation is a wholly owned subsidiary of Sony Group Corporation and the global leader in image sensors. Our semiconductor business also includes a variety of other parts including microdisplays, LSIs, and laser diodes. We strive to provide advanced imaging technologies that bring greater convenience and fun to people's lives. In addition, we also work to develop and bring to market new kinds of sensing technologies with the aim of offering various solutions that will take the visual and recognition capabilities of both human and machines to greater heights. For more information, please visit https://www.sony-semicon.co.jp/e/.About DENSODENSO is a $44.6 billion global mobility supplier that develops advanced technology and components for nearly every vehicle make and model on the road today. With manufacturing at its core, DENSO invests in its 200 facilities to produce thermal, powertrain, mobility, electrification, & electronic systems, to create jobs that directly change how the world moves. The company's 168,000+ employees are paving the way to a mobility future that improves lives, eliminates traffic accidents, and preserves the environment. Globally headquartered in Kariya, Japan, DENSO spent 10.0 percent of its global consolidated sales on research and development in the fiscal year ending March 31, 2021. For more information about global DENSO, visit https://www.denso.com/global. Copyright 2022 JCN Newswire. All rights reserved. (via SEAPRWire)

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Showa Denko Accelerates Search for Optimal Formulation of Semiconductor Materials with Quantum Computing Technology

TOKYO, Feb 10, 2022 - (ACN Newswire via SEAPRWire.com) - Showa Denko K.K. (SDK; TSE:4004) has demonstrated that it is possible to dramatically speed up the time required to search for optimal formulations of semiconductor materials, from several decades to several tens of seconds, using quantum computing technology.Image of optimization of semiconductor materials formulationSemiconductor materials contain a large number of ingredients such as resins, fillers and additives in various mixing ratios; by optimizing these formulations high-performance materials are obtained. However, the theoretical number of combinations for the development theme that we are working on is enormous, exceeding 10 to the 50th power. Thus, it would take decades to explore all possible combinations of these ingredients and their mixing ratios with conventional artificial intelligence (AI) models, and for this reason only a portion of the theoretical combinations had been extracted to search for the optimal combination of formulations.To reduce the time required for the exploration, we focused on Fujitsu Ltd's Digital Annealer(1), the first quantum-inspired digital technology(2). In order to utilize Digital Annealer, input in the form of an Ising model(3), an analysis method of statistical mechanics, is required. We were successful in expressing an originally developed AI model, capable of predicting the characteristics of semiconductor materials from the complex compounding conditions of materials, in the Ising model. By simulating the Ising model on Digital Annealer, we have reduced the required exploration time to tens of seconds, or about 1/72,000 of the time required by conventional AI models, which search by conditions limiting the type and amount of compounding. In addition, we were able to obtain a formula that achieves 30% higher performance as a semiconductor material.In our "Long-term Vision for Newly Integrated Company," the Showa Denko Group announced that it would commit itself to the research and development of AI and computational science, the core of its fundamental R&D activities. The results of this development are an example of the achievements of R&D activities based on the application of "Chemistry to Think" on "Chemistry to Formulate," both of which the Group has defined as basic frameworks for technological development. The Group will apply this development to various materials, accelerate its development activities, and provide customers with solutions for problems, thereby contributing to a sustainable society.(1) Digital Annealer: Domain specific architecture (basic computer design consisting of memory and computing circuits) specialized in solving computationally intensive combinatorial optimization problems. (https://www.fujitsu.com/global/services/business-services/digital-annealer/)(2) Quantum-inspired computing technology: High-performance computing technology inspired by quantum technology, though not directly using quantum effects.(3) Ising model: A statistical mechanical model for describing the behavior of spins in magnetic materials. The model describes the macroscopic magnetization of a magnetic material by considering the interaction between the spins and the coupling to the external magnetic field. The model is applied to a wide range of research areas, including combinatorial optimization problems.About Showa Denko K.K.Showa Denko K.K. (SDK; TSE:4004, ADR:SHWDY) is a major manufacturer of chemical products serving from heavy industry to computers and electronics. The Petrochemicals Sector provides cracker products such as ethylene and propylene, the Chemicals Sector provides industrial, high-performance and high-purity gases and chemicals for semicon and other industries, the Inorganics Sector provides ceramic products, such as alumina, abrasives, refractory/graphite electrodes and fine carbon products. The Aluminum Sector provides aluminum materials and high-value-added fabricated aluminum, the Electronics Sector provides HD media, compound semiconductors such as ultra high bright LEDs, and rare earth magnetic alloys, and the Advanced Battery Materials Department (ABM) provides lithium-ion battery components. For more information, please visit www.sdk.co.jp/english/.For further information, contact:Showa Denko K.K., Brand Communication Department, Tel: 81-3-5470-3235 Copyright 2022 ACN Newswire. All rights reserved. (via SEAPRWire)

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Showa Denko Accelerates Search for Optimal Formulation of Semiconductor Materials Leveraging Quantum Computing Technology

TOKYO, Feb 10, 2022 - (ACN Newswire via SEAPRWire.com) - Showa Denko K.K. (SDK; TSE:4004) has demonstrated that it is possible to dramatically speed up the time required to search for optimal formulations of semiconductor materials, from several decades to several tens of seconds, using quantum computing technology.Semiconductor materials contain a large number of ingredients such as resins, fillers and additives in various mixing ratios; by optimizing these formulations high-performance materials are obtained. However, the theoretical number of combinations for the development theme that we are working on is enormous, exceeding 10 to the 50th power. Thus, it would take decades to explore all possible combinations of these ingredients and their mixing ratios with conventional artificial intelligence (AI) models, and for this reason only a portion of the theoretical combinations had been extracted to search for the optimal combination of formulations.To reduce the time required for the exploration, we focused on Fujitsu Ltd's Digital Annealer(1), the first quantum-inspired digital technology(2). In order to utilize Digital Annealer, input in the form of an Ising model(3), an analysis method of statistical mechanics, is required. We were successful in expressing an originally developed AI model, capable of predicting the characteristics of semiconductor materials from the complex compounding conditions of materials, in the Ising model. By simulating the Ising model on Digital Annealer, we have reduced the required exploration time to tens of seconds, or about 1/72,000 of the time required by conventional AI models, which search by conditions limiting the type and amount of compounding. In addition, we were able to obtain a formula that achieves 30% higher performance as a semiconductor material.In our "Long-term Vision for Newly Integrated Company," the Showa Denko Group announced that it would commit itself to the research and development of AI and computational science, the core of its fundamental R&D activities. The results of this development are an example of the achievements of R&D activities based on the application of "Chemistry to Think" on "Chemistry to Formulate," both of which the Group has defined as basic frameworks for technological development. The Group will apply this development to various materials, accelerate its development activities, and provide customers with solutions for problems, thereby contributing to a sustainable society.(1) Digital Annealer: Domain specific architecture (basic computer design consisting of memory and computing circuits) specialized in solving computationally intensive combinatorial optimization problems. (https://www.fujitsu.com/global/services/business-services/digital-annealer/)(2) Quantum-inspired computing technology: High-performance computing technology inspired by quantum technology, though not directly using quantum effects.(3) Ising model: A statistical mechanical model for describing the behavior of spins in magnetic materials. The model describes the macroscopic magnetization of a magnetic material by considering the interaction between the spins and the coupling to the external magnetic field. The model is applied to a wide range of research areas, including combinatorial optimization problems.About Showa Denko K.K.Showa Denko K.K. (SDK; TSE:4004, ADR:SHWDY) is a major manufacturer of chemical products serving from heavy industry to computers and electronics. The Petrochemicals Sector provides cracker products such as ethylene and propylene, the Chemicals Sector provides industrial, high-performance and high-purity gases and chemicals for semicon and other industries, the Inorganics Sector provides ceramic products, such as alumina, abrasives, refractory/graphite electrodes and fine carbon products. The Aluminum Sector provides aluminum materials and high-value-added fabricated aluminum, the Electronics Sector provides HD media, compound semiconductors such as ultra high bright LEDs, and rare earth magnetic alloys, and the Advanced Battery Materials Department (ABM) provides lithium-ion battery components. For more information, please visit www.sdk.co.jp/english/.For further information, contact:Showa Denko K.K., Brand Communication Department, Tel: 81-3-5470-3235 Copyright 2022 ACN Newswire. All rights reserved. (via SEAPRWire)

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